JPH0351326B2 - - Google Patents
Info
- Publication number
- JPH0351326B2 JPH0351326B2 JP21869485A JP21869485A JPH0351326B2 JP H0351326 B2 JPH0351326 B2 JP H0351326B2 JP 21869485 A JP21869485 A JP 21869485A JP 21869485 A JP21869485 A JP 21869485A JP H0351326 B2 JPH0351326 B2 JP H0351326B2
- Authority
- JP
- Japan
- Prior art keywords
- surface acoustic
- acoustic wave
- conductive material
- material film
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010897 surface acoustic wave method Methods 0.000 claims description 78
- 239000000758 substrate Substances 0.000 claims description 39
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 35
- 239000010931 gold Substances 0.000 claims description 35
- 229910052737 gold Inorganic materials 0.000 claims description 35
- 229910052782 aluminium Inorganic materials 0.000 claims description 33
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 33
- 239000004020 conductor Substances 0.000 claims description 32
- 238000004519 manufacturing process Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 25
- 239000013078 crystal Substances 0.000 claims description 9
- 230000001902 propagating effect Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000013459 approach Methods 0.000 claims 2
- 239000010409 thin film Substances 0.000 description 37
- 239000010408 film Substances 0.000 description 31
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000007740 vapor deposition Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21869485A JPS6278906A (ja) | 1985-10-01 | 1985-10-01 | 弾性表面波装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21869485A JPS6278906A (ja) | 1985-10-01 | 1985-10-01 | 弾性表面波装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6278906A JPS6278906A (ja) | 1987-04-11 |
| JPH0351326B2 true JPH0351326B2 (en]) | 1991-08-06 |
Family
ID=16723947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21869485A Granted JPS6278906A (ja) | 1985-10-01 | 1985-10-01 | 弾性表面波装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6278906A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339840A (ja) * | 2005-05-31 | 2006-12-14 | Kyocera Kinseki Corp | 水晶振動子 |
| FR3114931B1 (fr) * | 2020-10-01 | 2022-12-30 | Frecnsys | Structure réflectrice pour dispositifs à ondes acoustiques de surface (SAW) |
-
1985
- 1985-10-01 JP JP21869485A patent/JPS6278906A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6278906A (ja) | 1987-04-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |